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FEATURED
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide

KEY FEATURES:

  • Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
ByQualcomm
Chipset
Type Development Kits
FEATURED
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.

KEY FEATURES:

  • Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
ByQualcomm
Chipset
Type Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide

KEY FEATURES:

  • Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
ByQualcomm
Chipset
Type Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.

KEY FEATURES:

  • Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
ByQualcomm
Chipset
Type Development Kits
Open-Q™ 6490CS SMARC SOM Development Kit
The Open-Q™ 6490CS SMARC SOM Development Kit is a development platform built to support evaluation and prototyping for Lantronix's SMARC System on Module (SOM) product line. Powered by the Qualcomm Dragonwing™ QCS6490 chipset, the kit is engineered to support proof-of-concept development for computer-vision and multimedia applications. Designed around the standard SMARC form factor, the platform highlights the SOM's capabilities and provides access to interfaces for MIPI CSI cameras, displays, Ethernet, audio, and sensors. The kit serves as a starting point for product evaluation and a reference platform for hardware-integration projects.

KEY FEATURES:

  • Up to 8GB LPDDR5 RAM + 64GB UFS
  • Additional storage via SD card and NVME
  • Multiple D-PHY MIPI camera & Display Ports
  • Multiple high speed connectivity options
  • Supports SMARC 2.2 SOM
  • Android™ 13 and Qualcomm Linux
Chipset
Type Development Kits
Open-Q™ 6490CS SMARC SOM
The Open-Q™ 6490CS SMARC SOM is a compute module designed for edge AI and embedded applications such as industrial PCs, robotics, security cameras and video surveillance, retail self-checkout, and video telematics. Based on the Qualcomm Dragonwing™ QCS6490 SoC, the module is built to support AI and machine-learning workloads within a compact SMARC form factor. Built on 6 nm process technology, it supports on-device AI processing, edge computing, Wi‑Fi 6E connectivity, multiple camera interfaces, and up to 4K video encoding and decoding. The pin-compatible Open-Q™ 6490CS SMARC SOM is designed to support product scalability across multiple performance tiers while helping reduce integration effort.

KEY FEATURES:

  • Up to 8GB LPDDR5 RAM + 64GB eMMC
  • Support UFS and NVMe storage
  • Android™ 13 and Qualcomm Linux
  • On-device AI Engine up to 12.5 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
  • SMARC 2.2 form factor
Chipset
Type System-on-Modules
COREKEY R6490WGQ / R6490Q / R5430Q Turnkey PICO-ITX 2.5" Turnkey PCBA
CRI COREKEY PICO-ITX 2.5" Turnkey PCBA (R6490WGQ / R6490Q / R5430Q) – Built on Coretronic Reality's COREXOM SOM family and powered by the Qualcomm Dragonwing™ QCS6490 or QCS5430 SoC, this 100 × 72 mm PICO-ITX 2.5" single-board controller is designed to support edge-computing applications within a compact form factor. The QCS6490 integrates the Qualcomm® Kryo™ 670 CPU and an AI accelerator within the Qualcomm® Hexagon™ processor, while the QCS5430 provides an alternative configuration within the same form factor. Three SKUs support a range of deployment requirements: R6490WGQ with integrated Wi‑Fi 6E, Bluetooth®, and GNSS; R6490Q without wireless connectivity for wired designs; and R5430Q as an entry-level configuration. The board features dual Gigabit Ethernet, USB 3.2 Gen 1 Type‑A and Type‑C (with DisplayPort Alt Mode), four RS‑232 ports, a 40‑pin GPIO header with QUP-configurable peripherals (SPI, I²C, UART, I²S, and I3C), two MIPI CSI camera connectors, and HDMI or eDP (2‑lane, 30‑pin) primary display output. An optional M.2 E‑key socket (PCIe Gen3 x1) supports Wi‑Fi and Bluetooth expansion, while DC‑in (20 V @ 5 A) or optional USB‑C PD input powers the system. An optional USB‑C PD output provides up to 36 W of power delivery. Supporting Windows 11 IoT Enterprise LTSC, Android 13, Ubuntu 24.04 LTS, and Qualcomm Linux, and available with an optional fanless enclosure, the platform is designed to help simplify hardware integration and support product-development workflows. The solution is intended for applications such as industrial automation, smart-building systems, digital signage, AI boxes, AI cameras, robotics, kiosks, and HMI systems.

KEY FEATURES:

  • High-performance Dragonwing QCS6490 (6 nm) / QCS5430 SoC with integrated NPU (QCS6490: up to 12 TOPS
  • Three SKUs: R6490WGQ (Wi-Fi 6E / BT / GNSS), R6490Q (no wireless), R5430Q (entry level)
  • Memory & storage: 8 GB LPDDR4 + 128 GB UFS (R6490WGQ / R6490Q); 4 GB LPDDR4 + 64 GB UFS (R5430Q)
  • Compact PICO-ITX 2.5" form factor: 100 × 72 mm, ~90 g
  • Display: HDMI or eDP (30-pin, 2-lane, up to 1920 × 1080 @ 60 fps) selectable via DIP switch; seconda
  • Dual MIPI CSI 4-lane camera connectors (supports IMX577 camera modules)
  • Dual 1 GbE RJ45
  • USB 3.2 Gen 1 Type-A × 2, USB Type-C × 1, USB 2.0 × 2 (2.0 mm header)
  • RS-232 × 4 (with transceivers), debug UART, 40-pin GPIO / peripheral header
  • Optional M.2 E-key (PCIe Gen3 x1) for Wi-Fi/BT (R6490Q / R5430Q); IPEX antenna connectors on R6490WG
  • WSA8835 speaker amplifier, RX8900CE RTC, fan connector, user-definable LEDs, and onboard Power / Vol
  • Power input: DC-in 20 V @ 5 A, or optional USB-C PD-in; optional USB-C PD-out (up to 36 W)
  • Supports Windows 11 IoT Enterprise LTSC, Android 13, Ubuntu 24.04 LTS
  • Optional fanless aluminum enclosure
Chipset
Type Single-Board Computers
Aikri QCS6490: Aikri-64X-90LS-8
eInfochips Aikri 6490 SoM is powered by the Qualcomm® QCS6490 processor, a 6nm processor with superior performance, power efficiency and powerful computing. The Aikri 6490 SoM is the best fit for designing Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems.

KEY FEATURES:

  • Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
  • Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
  • 8GB LPDDR5 and 128GB UFS; OS: Linux
Chipset
Type System-on-Modules
Aikri QCS6490: Aikri-64X-90AS-8
eInfochips Aikri 6490 SoM is powered by the Qualcomm® QCS6490 processor, a 6nm processor with superior performance, power efficiency and powerful computing. The Aikri 6490 SoM is the best fit for designing Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems.

KEY FEATURES:

  • Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
  • Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
  • 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
Chipset
Type System-on-Modules