Navigator

Close
2024 Security Bulletins
DecemberNovemberOctoberSeptemberAugustJulyJuneMayAprilMarchFebruaryJanuary

Legal notice

February 2024 Security Bulletin

Updated On: 02/05/2024

This security bulletin is intended to help Qualcomm Technologies, Inc. (QTI) customers incorporate security updates in launched or upcoming devices. This document includes (i) a description of security issues that have been addressed in QTI’s proprietary code and (ii) links to publicly available code where security issues have been addressed.

Please reach out to securitybulletin@qti.qualcomm.com for any questions related to this bulletin.

Table of Contents

Announcements
Acknowledgements
Proprietary Software Issues
Open Source Software Issues
Industry Coordination

Announcements

None

Acknowledgements

We would like to thank these researchers for their contributions in reporting these issues to us.

CVE-2023-33072 Mahdi Braik of the Apple Media Products RedTeam
CVE-2023-43516,CVE-2023-43520,CVE-2023-43534,CVE-2023-33064,CVE-2023-33065,CVE-2023-33067,CVE-2023-33068,CVE-2023-33069 Conghui Wang (conghuiwang)
CVE-2023-43518,CVE-2023-43519 Zinuo Han(https://twitter.com/ele7enxxh) of OPPO Amber Security Lab
CVE-2023-43532,CVE-2023-43535 Kiwan Ko (gogil)
CVE-2023-33077 Reported to us through Google Android Security team; please see bulletins at https://source.android.com/security/overview/acknowledgements/ for individual credit information. For issues rated medium or lower, the individual credit information may appear in a future Android major release bulletin.

Proprietary Software Issues

The tables below summarize security vulnerabilities that were addressed through proprietary software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-33046 High High Trusted Execution Environment Internal
CVE-2023-33049 High High Multi-Mode Call Processor Internal
CVE-2023-33057 High High Multi-Mode Call Processor Internal
CVE-2023-33058 High High Modem Internal
CVE-2023-33060 High High Core Internal
CVE-2023-33072 High Critical Core 12/20/2022
CVE-2023-33076 High Medium Core Internal
CVE-2023-43517 High High Multimedia Internal
CVE-2023-43518 High High Video 06/27/2023
CVE-2023-43519 High High Video 06/27/2023
CVE-2023-43522 High High WLAN Firmware Internal
CVE-2023-43523 High High WLAN Firmware Internal
CVE-2023-43532 High High Display 07/10/2023
CVE-2023-43533 High High WLAN Firmware Internal
CVE-2023-43535 High High Display 07/04/2023
CVE-2023-43536 High High WLAN Firmware Internal

This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-33077 Medium Medium HLOS 02/23/2023

CVE-2023-33046

CVE ID CVE-2023-33046
Title Time-of-check Time-of-use (TOCTOU) Race Condition in Trusted Execution Environment
Description Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation.
Technology Area Trusted Execution Environment
Vulnerability Type CWE-367 Time-of-check Time-of-use (TOCTOU) Race Condition
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/08/07
Affected Chipsets* AR8035, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8295P, QCA6391, QCA6574AU, QCA6595, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCM8550, QCN6024, QCN9011, QCN9012, QCN9024, QCS7230, QCS8250, QCS8550, QRB5165M, QRB5165N, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA8295P, SA8540P, SA9000P, SG8275P, SM8550P, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, SSG2115P, SSG2125P, SXR1230P, SXR2230P, WCD9380, WCD9385, WCD9390, WCD9395, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33049

CVE ID CVE-2023-33049
Title Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor
Description Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.
Technology Area Multi-Mode Call Processor
Vulnerability Type CWE-401 Improper Release of Memory Before Removing Last Reference ('Memory Leak')
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/08/07
Affected Chipsets* 315 5G IoT Modem, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6174A, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574A, QCA6584AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM6490, QCM8550, QCN6024, QCN6224, QCN6274, QCN9024, QCS4490, QCS6490, QCS8550, QEP8111, QFW7114, QFW7124, Qualcomm® Video Collaboration VC3 Platform, SD855, SD865 5G, SD888, SDX55, SDX57M, SG8275P, SM7250P, SM7315, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X35 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SXR2130, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33057

CVE ID CVE-2023-33057
Title Improper Input Validation in Multi-Mode Call Processor
Description Transient DOS in Multi-Mode Call Processor while processing UE policy container.
Technology Area Multi-Mode Call Processor
Vulnerability Type CWE-20 Improper Input Validation
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/08/07
Affected Chipsets* 315 5G IoT Modem, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6174A, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574A, QCA6584AU, QCA6595AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM6490, QCM8550, QCN6024, QCN6224, QCN6274, QCN9024, QCS4490, QCS6490, QCS8550, QEP8111, QFW7114, QFW7124, Qualcomm® Video Collaboration VC3 Platform, SD855, SD865 5G, SD888, SDX55, SDX57M, SG8275P, SM7250P, SM7315, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X35 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SXR2130, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33058

CVE ID CVE-2023-33058
Title Buffer Copy Without Checking Size of Input in Modem
Description Information disclosure in Modem while processing SIB5.
Technology Area Modem
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 8.2
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L
Date Reported Internal
Customer Notified Date 2023/08/07
Affected Chipsets* AR8035, FastConnect 6700, FastConnect 6900, FastConnect 7800, QCA6584AU, QCA6698AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM8550, QCN6024, QCN6224, QCN6274, QCN9024, QCS4490, QCS8550, QFW7114, QFW7124, SG8275P, SM8550P, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, WCD9340, WCD9370, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33060

CVE ID CVE-2023-33060
Title Buffer Over-read in Core
Description Transient DOS in Core when DDR memory check is called while DDR is not initialized.
Technology Area Core
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.1
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/08/07
Affected Chipsets* 9205 LTE Modem, AQT1000, AR8031, C-V2X 9150, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6800, FSM10056, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5302, IPQ5312, IPQ5332, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028, IPQ9008, IPQ9554, IPQ9570, IPQ9574, MDM9205S, QCA0000, QCA4004, QCA4024, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6430, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8386, QCA9377, QCC710, QCF8000, QCF8001, QCM6125, QCN5021, QCN5022, QCN5052, QCN5121, QCN5122, QCN5152, QCN6023, QCN6024, QCN6402, QCN6412, QCN6422, QCN6432, QCN9000, QCN9012, QCN9013, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9274, QCS410, QCS610, QCS6125, QCS8155, QTS110, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Robotics RB3 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SC8180X+SDX55, SD 675, SD670, SD675, SD730, SD855, SDX55, SDX65M, SM6250, SM6250P, Smart Audio 400 Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon Auto 5G Modem-RF, Snapdragon Wear 1300 Platform, Snapdragon X24 LTE Modem, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon Auto 4G Modem, SXR1120, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9306, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9371, WCD9375, WCD9380, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WSA8810, WSA8815

CVE-2023-33072

CVE ID CVE-2023-33072
Title Buffer copy without checking size of Input in Core
Description Memory corruption in Core while processing control functions.
Technology Area Core
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating High
CVSS Rating Critical
CVSS Score 9.3
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Date Reported 2022/12/20
Customer Notified Date 2023/08/07
Affected Chipsets* 315 5G IoT Modem, 9205 LTE Modem, AQT1000, AR8031, AR8035, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5302, IPQ5312, IPQ5332, IPQ9008, IPQ9554, IPQ9570, IPQ9574, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA0000, QCA4004, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9377, QCA9984, QCC710, QCC711, QCC7225, QCC7226, QCC7228, QCF8000, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM6490, QCM8550, QCN6024, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN7606, QCN9000, QCN9011, QCN9012, QCN9013, QCN9024, QCN9074, QCN9274, QCS2290, QCS4290, QCS4490, QCS6490, QCS7230, QCS8250, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QEP8111, QFW7114, QFW7124, QRB5165M, QRB5165N, QRU1032, QRU1052, QRU1062, QSM8250, QSM8350, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA6145P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8255P, SA8295P, SA8540P, SA8650P, SA8770P, SA8775P, SA9000P, SC8380XP, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD662, SD670, SD675, SD855, SD865 5G, SD888, SDX55, SDX57M, SDX65M, SG4150P, SG8275P, SM4125, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 1300 Platform, Snapdragon X24 LTE Modem, Snapdragon X35 5G Modem-RF System, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SRV1H, SRV1M, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9306, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33076

CVE ID CVE-2023-33076
Title Configuration Issue in Core
Description Memory corruption in Core when updating rollback version for TA and OTA feature is enabled.
Technology Area Core
Vulnerability Type CWE-16 Configuration
Access Vector Local
Security Rating High
CVSS Rating Medium
CVSS Score 5.9
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Date Reported Internal
Customer Notified Date 2023/08/07
Affected Chipsets* AQT1000, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCC710, QCM4490, QCM8550, QCN6024, QCN6224, QCN6274, QCN9024, QCS4490, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QEP8111, QFW7114, QFW7124, QRU1032, QRU1052, QRU1062, QSM8350, Robotics RB3 Platform, SA6145P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8255P, SA8295P, SA8540P, SA8650P, SA8770P, SA8775P, SA9000P, SC8380XP, SD 675, SD 8 Gen1 5G, SD 8CX, SD670, SD675, SD855, SD865 5G, SDX55, SDX57M, SG8275P, SM7250P, SM8550P, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X24 LTE Modem, Snapdragon X35 5G Modem-RF System, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3980, WCN3988, WCN3990, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43517

CVE ID CVE-2023-43517
Title Improper Access Control in Automotive Multimedia
Description Memory corruption in Automotive Multimedia due to improper access control in HAB.
Technology Area Multimedia
Vulnerability Type CWE-284 Improper Access Control
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/11/06
Affected Chipsets* QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6574AU, QCA6595, QCA6696, QCA6698AQ, SA8255P, SA8295P, SA8540P, SA8650P, SA8770P, SA8775P, SA9000P, SRV1H, SRV1M

CVE-2023-43518

CVE ID CVE-2023-43518
Title Untrusted Pointer Dereference in Video
Description Memory corruption in video while parsing invalid mp2 clip.
Technology Area Video
Vulnerability Type CWE-822 Untrusted Pointer Dereference
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.3
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Date Reported 2023/06/27
Customer Notified Date 2023/11/06
Affected Chipsets* AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8775P, QCA6310, QCA6320, QCA6391, QCA6420, QCA6430, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN7606, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8770P, SA8775P, SA9000P, SD 8 Gen1 5G, SD660, SD670, SD730, SD835, SD855, SD865 5G, SD888, SG4150P, SM6250, SM7250P, SM7315, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2230P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3610, WCN3615, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43519

CVE ID CVE-2023-43519
Title Buffer Copy without Checking Size of Input (`Classic Buffer Overflow`) in Video
Description Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size.
Technology Area Video
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.3
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Date Reported 2023/06/27
Customer Notified Date 2023/11/06
Affected Chipsets* AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6430, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCM2290, QCM4290, QCM4490, QCM6490, QCN7606, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6490, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD 8 Gen1 5G, SD660, SD730, SD835, SD855, SD865 5G, SD888, SM6250, SM7250P, SM7315, SM7325P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SRV1H, SRV1M, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2230P, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

CVE-2023-43522

CVE ID CVE-2023-43522
Title NULL Pointer Dereference in WLAN Firmware
Description Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.
Technology Area WLAN Firmware
Vulnerability Type CWE-476 NULL Pointer Dereference
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/11/06
Affected Chipsets* AQT1000, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5010, IPQ5028, IPQ5302, IPQ5312, IPQ5332, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9554, IPQ9570, IPQ9574, PMP8074, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA0000, QCA1062, QCA1064, QCA2062, QCA2064, QCA2065, QCA2066, QCA4024, QCA6174A, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9886, QCA9888, QCA9889, QCA9980, QCA9984, QCA9985, QCA9986, QCA9990, QCA9992, QCA9994, QCC2073, QCC2076, QCC710, QCF8000, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM6490, QCM8550, QCN5021, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6100, QCN6102, QCN6112, QCN6122, QCN6132, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QCS2290, QCS4290, QCS4490, QCS6490, QCS8550, QEP8111, QFW7114, QFW7124, QRB5165M, QRB5165N, QSM8250, QSM8350, Qualcomm® Video Collaboration VC3 Platform, Robotics RB5 Platform, SA4150P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SC8180X+SDX55, SC8380XP, SD 8 Gen1 5G, SD460, SD660, SD662, SD730, SD855, SD865 5G, SD888, SDX55, SG4150P, SG8275P, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X35 5G Modem-RF System, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SRV1H, SRV1M, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2130, SXR2230P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43523

CVE ID CVE-2023-43523
Title Reachable Assertion in WLAN Firmware
Description Transient DOS while processing 11AZ RTT management action frame received through OTA.
Technology Area WLAN Firmware
Vulnerability Type CWE-617 Reachable Assertion
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/11/06
Affected Chipsets* AR8035, CSR8811, FastConnect 6800, FastConnect 6900, FastConnect 7800, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5010, IPQ5028, IPQ5302, IPQ5312, IPQ5332, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8070A, IPQ8071A, IPQ8072A, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, IPQ9008, IPQ9554, IPQ9570, IPQ9574, QAM8255P, QAM8650P, QAM8775P, QCA0000, QCA4024, QCA6391, QCA6426, QCA6436, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA9888, QCA9889, QCC2073, QCC2076, QCC710, QCF8000, QCF8001, QCM8550, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN5164, QCN6023, QCN6024, QCN6122, QCN6132, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN9000, QCN9001, QCN9002, QCN9003, QCN9012, QCN9013, QCN9022, QCN9024, QCN9070, QCN9072, QCN9074, QCN9100, QCN9274, QCS8550, QFW7114, QFW7124, SC8380XP, SD 8 Gen1 5G, SD865 5G, SDX65M, SG8275P, SM8550P, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon AR2 Gen 1 Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, WCD9340, WCD9380, WCD9385, WCD9390, WCD9395, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43532

CVE ID CVE-2023-43532
Title Untrusted Pointer Dereference in Display
Description Memory corruption while reading ACPI config through the user mode app.
Technology Area Display
Vulnerability Type CWE-822 Untrusted Pointer Dereference
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/07/10
Customer Notified Date 2023/11/06
Affected Chipsets* FastConnect 6700, FastConnect 6900, FastConnect 7800, SC8380XP, Snapdragon 7c+ Gen 3 Compute, Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), WCD9380, WCD9385, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43533

CVE ID CVE-2023-43533
Title Buffer Over-read in WLAN Firmware
Description Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.
Technology Area WLAN Firmware
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/11/06
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8035, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5302, IPQ5312, IPQ5332, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA1062, QCA1064, QCA2062, QCA2064, QCA2065, QCA2066, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6554A, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA8386, QCC2073, QCC2076, QCC710, QCF8000, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN6024, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN9024, QCN9274, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS8550, QEP8111, QFW7114, QFW7124, QSM8250, QSM8350, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Robotics RB3 Platform, SA4150P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SC8180X+SDX55, SC8380XP, SD 455, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD660, SD662, SD670, SD675, SD730, SD835, SD855, SD865 5G, SD888, SDX55, SG4150P, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 630 Mobile Platform, Snapdragon 636 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X35 5G Modem-RF System, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SRV1H, SRV1M, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43535

CVE ID CVE-2023-43535
Title Improper Validation of Array Index in Display
Description Memory corruption when negative display IDs are sent as input while processing DISPLAYESCAPE event trigger.
Technology Area Display
Vulnerability Type CWE-129 Improper Validation of Array Index
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 8.4
CVSS String CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/07/04
Customer Notified Date 2023/11/06
Affected Chipsets* FastConnect 6700, FastConnect 6900, FastConnect 7800, SC8380XP, Snapdragon 7c+ Gen 3 Compute, Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), WCD9380, WCD9385, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-43536

CVE ID CVE-2023-43536
Title Buffer Over-read in WLAN Firmware
Description Transient DOS while parse fils IE with length equal to 1.
Technology Area WLAN Firmware
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2023/11/06
Affected Chipsets* 315 5G IoT Modem, AQT1000, AR8031, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ4018, IPQ4028, IPQ4029, IPQ5010, IPQ5302, IPQ5312, IPQ5332, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8069, IPQ8070, IPQ8070A, IPQ8071, IPQ8072, IPQ8072A, IPQ8074, IPQ8074A, IPQ8076A, IPQ8078, IPQ8078A, IPQ8174, IPQ9554, IPQ9570, IPQ9574, PMP8074, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA1062, QCA1064, QCA2062, QCA2064, QCA2065, QCA2066, QCA4024, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6428, QCA6430, QCA6431, QCA6436, QCA6438, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8337, QCA8386, QCA9888, QCA9889, QCA9898, QCA9980, QCA9984, QCA9990, QCA9992, QCA9994, QCC2073, QCC2076, QCC710, QCF8000, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN5021, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5124, QCN5152, QCN5154, QCN6024, QCN6100, QCN6102, QCN6112, QCN6122, QCN6132, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN7605, QCN7606, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9022, QCN9024, QCN9074, QCN9274, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS7230, QCS8250, QCS8550, QEP8111, QFW7114, QFW7124, QRB5165M, QRB5165N, QSM8250, QSM8350, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SC8180X+SDX55, SC8380XP, SD 675, SD 8 Gen1 5G, SD 8CX, SD460, SD660, SD662, SD670, SD675, SD730, SD855, SD865 5G, SD888, SDX55, SG4150P, SG8275P, SM4125, SM6250, SM6250P, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 712 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c Compute Platform (SC7180-AC), Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 850 Mobile Compute Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform (SC8180X-AA, AB), Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X35 5G Modem-RF System, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SRV1H, SRV1M, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 300 Platform, Vision Intelligence 400 Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3999, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2023-33077

CVE ID CVE-2023-33077
Title Buffer Copy Without Checking Size of Input in HLOS
Description Memory corruption in HLOS while converting from authorization token to HIDL vector.
Technology Area HLOS
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/02/23
Customer Notified Date 2023/08/07
Affected Chipsets* AQT1000, AR8035, C-V2X 9150, FastConnect 6200, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QCS8155, QFW7114, QFW7124, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD670, SD835, SD855, SD865 5G, SDX55, Snapdragon 670 Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SW5100, SW5100P, SXR1120, SXR2130, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9380, WCN3610, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN3990, WSA8810, WSA8815, WSA8830, WSA8835

*The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

Open Source Software Issues

The tables below summarize security vulnerabilities that were addressed through open source software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-43513 High High PCIe Internal
CVE-2023-43516 High High Video 06/18/2023
CVE-2023-43520 High High WLAN HOST 07/26/2023
CVE-2023-43534 High High WLAN HOST 07/26/2023

This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2023-33064 Medium Medium Audio 03/21/2023
CVE-2023-33065 Medium Medium Audio 03/21/2023
CVE-2023-33067 Medium Medium Audio 03/16/2023
CVE-2023-33068 Medium Medium Audio 03/16/2023
CVE-2023-33069 Medium Medium Audio 03/16/2023

CVE-2023-43513

CVE ID CVE-2023-43513
Title Use of Out-of-range Pointer Offset in PCIe
Description Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Technology Area PCIe
Vulnerability Type CWE-823 Use of Out-of-range Pointer Offset
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2023/10/02
Affected Chipsets* 315 5G IoT Modem, APQ8017, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FSM20055, FSM20056, Immersive Home 214 Platform, Immersive Home 216 Platform, Immersive Home 316 Platform, Immersive Home 318 Platform, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5010, IPQ6018, IPQ8074A, IPQ8174, IPQ9574, MDM9628, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA4024, QCA6174A, QCA6310, QCA6335, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8072, QCA8075, QCA8081, QCA8337, QCA9377, QCC710, QCM2290, QCM4290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8550, QCN5022, QCN5024, QCN5052, QCN5054, QCN5122, QCN5152, QCN6024, QCN6224, QCN6274, QCN9000, QCN9001, QCN9002, QCN9003, QCN9011, QCN9012, QCN9024, QCN9074, QCN9274, QCS2290, QCS410, QCS4290, QCS4490, QCS610, QCS6125, QCS6490, QCS7230, QCS8155, QCS8250, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QEP8111, QFW7114, QFW7124, QRB5165M, QRB5165N, QRU1032, QRU1052, QRU1062, QSM8350, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD 8 Gen1 5G, SD626, SD660, SD670, SD730, SD855, SD865 5G, SD888, SDM429W, SDX55, SG4150P, SG8275P, SM4125, SM6250, SM7250P, SM7315, SM7325P, SM8550P, Smart Audio 400 Platform, Smart Display 200 Platform (APQ5053-AA), Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 425 Mobile Platform, Snapdragon 429 Mobile Platform, Snapdragon 439 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 625 Mobile Platform, Snapdragon 626 Mobile Platform, Snapdragon 632 Mobile Platform, Snapdragon 660 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 665 Mobile Platform, Snapdragon 670 Mobile Platform, Snapdragon 675 Mobile Platform, Snapdragon 678 Mobile Platform (SM6150-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 710 Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 750G 5G Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 845 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X12 LTE Modem, Snapdragon X35 5G Modem-RF System, Snapdragon X50 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR1 Platform, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, SRV1H, SRV1M, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1120, SXR1230P, SXR2130, SXR2230P, Vision Intelligence 100 Platform (APQ8053-AA), Vision Intelligence 200 Platform (APQ8053-AC), Vision Intelligence 400 Platform, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3610, WCN3615, WCN3620, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**

CVE-2023-43516

CVE ID CVE-2023-43516
Title Use of out-of-range pointer offset in Video
Description Memory corruption when malformed message payload is received from firmware.
Technology Area Video
Vulnerability Type CWE-823 Use of Out-of-range Pointer Offset
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/06/18
Customer Notified Date 2023/11/06
Affected Chipsets* FastConnect 6900, FastConnect 7800, QCM8550, QCS8550, Snapdragon 8 Gen 1 Mobile Platform, WCD9380, WSA8830, WSA8835
Patch**

CVE-2023-43520

CVE ID CVE-2023-43520
Title Stack-based Buffer Overflow in WLAN HOST
Description Memory corruption when AP includes TID to link mapping IE in the beacons and STA is parsing the beacon TID to link mapping IE.
Technology Area WLAN HOST
Vulnerability Type CWE-121 Stack-based Buffer Overflow
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 8.6
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:H
Date Reported 2023/07/26
Customer Notified Date 2023/11/06
Affected Chipsets* AR8035, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6391, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA8081, QCA8337, QCC2073, QCC2076, QCC710, QCM8550, QCN6224, QCN6274, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165N, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8650P, SA8770P, SA8775P, SA9000P, SM8550P, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR2 Gen 1 Platform, Snapdragon X75 5G Modem-RF System, SRV1H, SRV1M, SSG2115P, SSG2125P, SXR1230P, SXR2230P, WCD9340, WCD9380, WCD9385, WCD9390, WCD9395, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**

CVE-2023-43534

CVE ID CVE-2023-43534
Title Use of Out-of-range Pointer Offset in WLAN HOST
Description Memory corruption while validating the TID to Link Mapping action request frame, when a station connects to an access point.
Technology Area WLAN HOST
Vulnerability Type CWE-823 Use of Out-of-range Pointer Offset
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 8.6
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:H
Date Reported 2023/07/26
Customer Notified Date 2023/11/06
Affected Chipsets* AR8035, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6391, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA8081, QCA8337, QCC2073, QCC2076, QCC710, QCM8550, QCN6224, QCN6274, QCS7230, QCS8250, QCS8550, QFW7114, QFW7124, QRB5165N, Qualcomm® Video Collaboration VC5 Platform, Robotics RB5 Platform, SA6155P, SA8155P, SA8195P, SA8255P, SA8650P, SA8770P, SA8775P, SA9000P, SM8550P, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR2 Gen 1 Platform, Snapdragon X75 5G Modem-RF System, SRV1H, SRV1M, SSG2115P, SSG2125P, SXR1230P, SXR2230P, WCD9340, WCD9380, WCD9385, WCD9390, WCD9395, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**

CVE-2023-33064

CVE ID CVE-2023-33064
Title Buffer Over-read in Audio
Description Transient DOS in Audio when invoking callback function of ASM driver.
Technology Area Audio
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 5.5
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:N/A:H
Date Reported 2023/03/21
Customer Notified Date 2023/08/07
Affected Chipsets* AQT1000, AR8035, C-V2X 9150, FastConnect 6200, FastConnect 6800, FastConnect 6900, FastConnect 7800, MDM9628, MDM9650, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QFW7114, QFW7124, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD835, SD855, SD865 5G, SDM429W, Snapdragon 429 Mobile Platform, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SXR2130, WCD9335, WCD9340, WCD9341, WCD9370, WCD9380, WCN3610, WCN3620, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3990, WSA8810, WSA8815
Patch**

CVE-2023-33065

CVE ID CVE-2023-33065
Title Buffer Over-read in Audio
Description Information disclosure in Audio while accessing AVCS services from ADSP payload.
Technology Area Audio
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.1
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:L
Date Reported 2023/03/21
Customer Notified Date 2023/08/07
Affected Chipsets* AQT1000, AR8035, C-V2X 9150, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, MDM9650, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QFW7114, QFW7124, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD835, SD855, SD865 5G, SD888, SDM429W, SM7315, SM7325P, Snapdragon 429 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SXR2130, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835
Patch**

CVE-2023-33067

CVE ID CVE-2023-33067
Title Use of Out-of-range Pointer Offset in Audio
Description Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Technology Area Audio
Vulnerability Type CWE-823 Use of Out-of-range Pointer Offset
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/03/16
Customer Notified Date 2023/08/07
Affected Chipsets* 9206 LTE Modem, AQT1000, AR8035, C-V2X 9150, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, MDM9628, MDM9650, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QFW7114, QFW7124, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD835, SD855, SD865 5G, SD888, SDM429W, SM7315, SM7325P, Smart Audio 200 Platform, Snapdragon 1200 Wearable Platform, Snapdragon 429 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon Wear 4100+ Platform, Snapdragon X5 LTE Modem, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SXR2130, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835
Patch**

CVE-2023-33068

CVE ID CVE-2023-33068
Title Buffer Copy Without Checking Size of Input in Audio
Description Memory corruption in Audio while processing IIR config data from AFE calibration block.
Technology Area Audio
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/03/16
Customer Notified Date 2023/08/07
Affected Chipsets* AQT1000, AR8035, C-V2X 9150, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, MDM9650, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QFW7114, QFW7124, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD835, SD855, SD865 5G, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SXR2130, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835
Patch**

CVE-2023-33069

CVE ID CVE-2023-33069
Title Buffer Copy Without Checking Size of Input in Audio
Description Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Technology Area Audio
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2023/03/16
Customer Notified Date 2023/08/07
Affected Chipsets* 9206 LTE Modem, AQT1000, AR8035, C-V2X 9150, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, MDM9628, MDM9650, MSM8996AU, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA8081, QCA8337, QCA9367, QCA9377, QCC710, QCN6224, QCN6274, QCN9074, QCS410, QCS610, QFW7114, QFW7124, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8650P, SA8770P, SA8775P, SA9000P, SD835, SD855, SD865 5G, SD888, SDM429W, SM7315, SM7325P, Smart Audio 200 Platform, Snapdragon 1200 Wearable Platform, Snapdragon 429 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 820 Automotive Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon Wear 4100+ Platform, Snapdragon X5 LTE Modem, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SRV1M, SXR2130, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835
Patch**

* The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

** Data is generated only at the time of bulletin creation

Industry Coordination

Security ratings of issues included in Android security bulletins and these bulletins match in the most common scenarios but may differ in some cases due to one of the following reasons:

  • Consideration of security protections such as SELinux not enforced on some platforms
  • Differences in assessment of some specific scenarios that involves local denial of service or privilege escalation vulnerabilities in the high level OS kernel

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.

Qualcomm Technologies, Inc.

San Diego, CA 92121

U.S.A.

© 2022 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.