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Legal notice

August 2026 Security Bulletin

Published: 08/03/2026

This security bulletin is intended to help Qualcomm Technologies, Inc. (QTI) customers incorporate security updates in launched or upcoming devices. This document includes (i) a description of security issues that have been addressed in QTI’s proprietary code and (ii) links to publicly available code where security issues have been addressed.

Please reach out to securitybulletin@qti.qualcomm.com for any questions related to this bulletin.

Table of Contents

Announcements
Acknowledgements
Proprietary Software Issues
Open Source Software Issues
Industry Coordination

Announcements

None

Acknowledgements

We would like to thank these researchers for their contributions in reporting these issues to us.

CVE-2026-24079,CVE-2026-24084 Bedran Karakoc
CVE-2026-25292 Chen Runlin, Xu Liangjun and Wu Haitao from Xiaomi ShadowBlade Security Lab
CVE-2026-24076 Andrea Monzani andrea.monzani@unimi.it
CVE-2026-24077 Igor Morgenstern
CVE-2026-24078 Dragos Vingarzan

Proprietary Software Issues

The tables below summarize security vulnerabilities that were addressed through proprietary software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2026-25289 Critical Critical WLAN Firmware Internal
CVE-2026-21366 High High Data Network Stack & Connectivity Internal
CVE-2026-24079 High High Data Modem 07/18/2025
CVE-2026-24080 High High Biometrics Internal
CVE-2026-24084 High High Multi-Mode Call Processor 08/25/2022
CVE-2026-25288 High High WLAN Firmware Internal

This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2026-24076 Medium Medium Bluetooth HOST 09/08/2025
CVE-2026-24078 Medium Medium Data Modem 10/07/2024

CVE-2026-25289

CVE ID CVE-2026-25289
Title Stack-based Buffer Overflow in WLAN Firmware
Description Memory Corruption when processing Device Capability Extended attributes in certain NAN Service Discovery Frames with invalid length values.
Technology Area WLAN Firmware
Vulnerability Type CWE-121 Stack-based Buffer Overflow
Access Vector Remote
Security Rating Critical
CVSS Rating Critical
CVSS Score 9.6
CVSS String CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2026/05/04
Affected Chipsets* AR8035, Cologne, CQ7790, CQ8725S, CQ8750M, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, FWA Gen 3 Ultra Platform, FWA Gen 5 Elite Platform, G2 Gen 1, G3x Gen 2, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5300, IPQ5302, IPQ5312, IPQ5332, IPQ9008, IPQ9554, IPQ9570, IPQ9574, IQX5121, IQX7181, Kobuk, LeMans_AU_LGIT, LeMansAU, Milos, Milos_IOT, Molokai, Netrani, Networking Pro 1210 Platform, Networking Pro 1610 Platform, Networking Pro 610 Platform, Networking Pro 810 Platform, Orne, Palawan25, Pandeiro, QAM8255P, QAM8397P, QAM8797P, QAMSRV1H, QAMSRV1M, QCA0000, QCA6391, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6777AQ, QCA6787AQ, QCA6797AQ, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA8695AU, QCC2073, QCC2076, QCC710, QCF8000, QCF8001, QCN5124, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN9000, QCN9011, QCN9012, QCN9024, QCN9274, QCS6690, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMB715, QMP1000, QMP2001, QPA1083BD, QPA1086BD, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, SA7255P, SA7775P, SA8255P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR2130P, SC8380XP, SDX65M, SDX81, SM6450P, SM6475P, SM6475Q, SM6650P, SM6850, SM7425, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8425, SM8550P, SM8635, SM8635P, SM8650Q, SM8735P, SM8750P, SM8845P, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X65 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon® Wear Elite platform, SRV1H, SRV1M, SXR2230P, SXR2250P, SXR2330P, SXR2350P, Themisto, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, X1E80100, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039, XRV7209, XRV9209

CVE-2026-21366

CVE ID CVE-2026-21366
Title Integer Overflow or Wraparound in Data Network Stack & Connectivity
Description Memory corruption while processing a packet with a size close to the maximum allowed value.
Technology Area Data Network Stack & Connectivity
Vulnerability Type CWE-190 Integer Overflow or Wraparound
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2026/02/02
Affected Chipsets* LeMans_AU_LGIT, LeMansAU, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA6574AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8695AU, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SRV1H, SRV1L, SRV1M

CVE-2026-24079

CVE ID CVE-2026-24079
Title Missing Authentication for Critical Function in Data Modem
Description Cryptographic Issue while processing registration requests with malformed or missing authentication parameters.
Technology Area Data Modem
Vulnerability Type CWE-306: Missing Authentication for Critical Function
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 8.1
CVSS String CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N
Date Reported 2025/07/18
Customer Notified Date 2026/02/02
Affected Chipsets* AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, Milos, Netrani, Orne, Palawan25, QCA6174A, QCA6391, QCA6574AU, QCA6584AU, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM2290, QCM4325, QCM4490, QCM5430, QCM6490, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCS2290, QCS4290, QCS4490, QCS8550, QEP8111, QFW7114, QFW7124, QMP1000, Qualcomm® Video Collaboration VC3 Platform, Robotics RB2 Platform, SD 8 Gen1 5G, SD662, SDX61, SM6225P, SM6650P, SM7325P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, SW5100, SW5100P, SW6100, SW6100P, Themisto, WCD9335, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2026-24080

CVE ID CVE-2026-24080
Title Buffer Copy Without Checking Size of Input in Biometrics
Description Memory Corruption when handling malformed request parameters in the fingerprint TA.
Technology Area Biometrics
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2026/02/02
Affected Chipsets* Cologne, FastConnect 6700, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QCA6574AU, QCA6595AU, QCA6678AQ, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA9000P, SW6100, SW6100P, Themisto, WCD9378C, WSA8840, WSA8845, WSA8845H, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039

CVE-2026-24084

CVE ID CVE-2026-24084
Title Insecure Security Identifier Mechanism in Multi-Mode Call Processor
Description Weak configuration when UE does not verify the consistency of its additional security capabilities with the replayed capabilities.
Technology Area Multi-Mode Call Processor
Vulnerability Type CWE-1294: Insecure Security Identifier Mechanism
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.5
CVSS String CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Date Reported 2022/08/25
Customer Notified Date 2026/02/02
Affected Chipsets* 5G Fixed Wireless Access Platform, AQT1000, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FWA Gen 3 Ultra Platform, Milos, Netrani, Orne, Palawan25, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6574AU, QCA6584AU, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM5430, QCM6490, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCS4490, QCS8550, QFW7114, QFW7124, QMP1000, Qualcomm® Video Collaboration VC3 Platform, SD 8 Gen1 5G, SDX57M, SDX61, SDX71M, SM6650P, SM7325P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon X80 5G Modem-RF System, Snapdragon Auto 4G Modem, WCD9340, WCD9341, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

CVE-2026-25288

CVE ID CVE-2026-25288
Title Buffer Over-read in WLAN Firmware
Description Transient DOS when processing a short target wake time channel usage response frame with insufficient packet size.
Technology Area WLAN Firmware
Vulnerability Type CWE-126 Buffer Over-read
Access Vector Remote
Security Rating High
CVSS Rating High
CVSS Score 7.4
CVSS String CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:C/C:N/I:N/A:H
Date Reported Internal
Customer Notified Date 2026/05/04
Affected Chipsets* Cologne, CQ7790, FastConnect 6900, FastConnect 7800, Molokai, Orne, Palawan25, Pandeiro, QLN1083BD, QLN1086BD, QMB715, QMP1000, QMP2001, QPA1083BD, QPA1086BD, QXM1093, QXM1094, QXM1095, QXM1096, SC8380XP, SM6850, SM8735P, SM8845P, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 8 Elite Gen 5, WCD9370, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9395, WCN6450, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039, XRV7209, XRV9209

CVE-2026-24076

CVE ID CVE-2026-24076
Title Buffer Copy Without Checking Size of Input in Bluetooth HOST
Description Memory Corruption when processing registry values with incorrect types using a direct query method.
Technology Area Bluetooth HOST
Vulnerability Type CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Access Vector Local
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.7
CVSS String CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Date Reported 2025/09/08
Customer Notified Date 2026/02/02
Affected Chipsets* AQT1000, Cologne, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA0000, QCA2062, QCA2064, QCA2065, QCA2066, QCA6391, QCA6420, QCA6430, QCM5430, QCM6490, Qualcomm® Video Collaboration VC3 Platform, SC8380XP, SM6250, Snapdragon 7c Compute Platform, Snapdragon 7c Gen 2 Compute Platform "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, WCD9340, WCD9341, WCD9370, WCD9375, WCD9378C, WCD9380, WCD9385, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039

CVE-2026-24078

CVE ID CVE-2026-24078
Title Exposure of Private Personal Information to an Unauthorized Actor in Data Modem
Description Information Disclosure when IPSec negotiation fails or is not established properly during NG-eCall SIP signaling.
Technology Area Data Modem
Vulnerability Type CWE-359: Exposure of Private Personal Information to an Unauthorized Actor
Access Vector Remote
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.5
CVSS String CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Date Reported 2024/10/07
Customer Notified Date 2026/02/02
Affected Chipsets* 5G Fixed Wireless Access Platform, AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, Milos, Netrani, Orne, Palawan25, QCA6174A, QCA6391, QCA6574A, QCA6574AU, QCA6584AU, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM2290, QCM4325, QCM4490, QCM5430, QCM6490, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCS2290, QCS4290, QCS4490, QCS8550, QEP8111, QFW7114, QFW7124, QMP1000, Qualcomm® Video Collaboration VC3 Platform, Robotics RB2 Platform, SD 8 Gen1 5G, SD662, SDX57M, SDX61, SM6225P, SM6650P, SM7325P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, SW5100, SW5100P, SW6100, SW6100P, Themisto, WCD9335, WCD9340, WCD9360, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

*The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

Open Source Software Issues

The tables below summarize security vulnerabilities that were addressed through open source software

This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2026-24083 High High Automotive Security Internal
CVE-2026-25292 High High Automotive Linux OS 01/18/2026
CVE-2026-6726 High High Windows Compute Internal
CVE-2026-6727 High High Windows Compute Internal

This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2026-24077 Medium Medium WLAN Host 09/08/2025

CVE-2026-24083

CVE ID CVE-2026-24083
Title Untrusted Pointer Dereference in Automotive Security
Description Memory Corruption while processing IOCTL device driver requests with invalid arguments.
Technology Area Automotive Security
Vulnerability Type CWE-822 Untrusted Pointer Dereference
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.8
CVSS String CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Date Reported Internal
Customer Notified Date 2026/02/02
Affected Chipsets* QAM8295P, QCA6696, SA8295P
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/securemsm-kernel/-/commit/a11bc68ea37ffe933645c0f4c0bb60834b3aa782

CVE-2026-25292

CVE ID CVE-2026-25292
Title Improper Validation of Syntactic Correctness of Input in Automotive Linux OS
Description Memory Corruption when processing untrusted user input in the fastboot command handler for audio framework configuration.
Technology Area Automotive Linux OS
Vulnerability Type CWE-1286: Improper Validation of Syntactic Correctness of Input
Access Vector Local
Security Rating High
CVSS Rating High
CVSS Score 7.6
CVSS String CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Date Reported 2026/01/18
Customer Notified Date 2026/05/04
Affected Chipsets* AR8031, AR8035, CQ7790, CQ8725S, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FWA Gen 3 Ultra Platform, FWA Gen 5 Elite Platform, G1 Gen 1, G2 Gen 1, G3x Gen 2, Kalpeni, Kobuk, LeMans_AU_LGIT, LeMansAU, Milos_IOT, Molokai, Netrani, Orne, Palawan25, Pandeiro, QAM8255P, QAM8295P, QAM8397P, QAM8797P, QAMSRV1H, QAMSRV1M, QCA2066, QCA6174A, QCA6391, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCA8386, QCA8695AU, QCA9367, QCA9377, QCC710, QCF8001, QCM2290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8838, QCN6224, QCN6274, QCN9011, QCN9012, QCS2290, QCS4290, QCS4490, QCS6690, QCS8550, QDU1000, QDU1110, QDU1210, QDX1010, QDX1011, QEP8111, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMB715, QMP1000, QMP2001, QPA1083BD, QPA1086BD, QRB5165N, QRU1032, Qualcomm Dragonwing™ QRU100 Platform, Qualcomm Dragonwing™ X100 Accelerator Card, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, Robotics RB5 Platform, SA4150P, SA4155P, SA510M, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8620P, SA8770P, SA9000P, SAR1165P, SC8380XP, SD662, SD865 5G, SDR753, SDX81, SM4850, SM4850P, SM6225P, SM6450P, SM6475P, SM6475Q, SM6850, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM8550P, SM8735P, SM8750P, SM8845P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon® Wear Elite platform, SRV1H, SRV1M, SW5100, SW5100P, SXR2330P, SXR2350P, Themisto, WCD9335, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, X1E80100, XRV7209, XRV9209
Patch**
  • https://git.codelinaro.org/clo/la/abl/tianocore/edk2/-/commit/3b03dab8faaa14b7ce0c179b6412a27132d3d851

CVE-2026-24077

CVE ID CVE-2026-24077
Title Integer Underflow (Wrap or Wraparound) in WLAN Host
Description Information Disclosure when processing wireless network channel switch information with improperly formatted length fields.
Technology Area WLAN Host
Vulnerability Type CWE-191 Integer Underflow (Wrap or Wraparound)
Access Vector Remote
Security Rating Medium
CVSS Rating Medium
CVSS Score 6.5
CVSS String CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Date Reported 2025/09/08
Customer Notified Date 2026/02/02
Affected Chipsets* AQT1000, AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, Milos, Netrani, Orne, Palawan25, QCA6391, QCA6420, QCA6430, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6777AQ, QCA6787AQ, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM2290, QCM4325, QCM4490, QCM5430, QCM6490, QCN6224, QCN6274, QCN9011, QCN9012, QCS2290, QCS4290, QCS4490, QFW7114, QFW7124, QMP1000, QRB5165M, QRB5165N, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB2 Platform, Robotics RB5 Platform, SA6155P, SA8155, SA8155P, SA8195P, SD 8 Gen1 5G, SD662, SD865 5G, SM6225P, SM6650P, SM7325P, SM7435, SM7635P, SM7675, SM7675P, SM8475P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SW5100, SW5100P, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Patch**
  • https://git.codelinaro.org/clo/la/platform/vendor/qcom-opensource/wlan/qcacld-3.0/-/commit/6d431a9e28c7e473979531c83c7c4114d7d0637b

CVE-2026-6726

CVE ID CVE-2026-6726
Description An information leakage vulnerability was reported in the TCG TPM 2.0 reference code that could allow a local attacker with elevated privileges to obtain a credential from a TPM-aware CA for a falsified TPM key (such as an Attestation Key, DevID Key or TLS authentication key) and falsify other TPM 2.0 attestations with this key. For more details, please refer to the Trusted Computing Group’s official advisory:https://trustedcomputinggroup.org/about/security/
Technology Area Windows Compute
Affected Chipsets* Snapdragon G1 Gen 2 Gaming Platform, 5G Fixed Wireless Access Platform, 9205 LTE Modem, 9205S Modem, AQT1000, AR8031, AR8035, C-V2X 9150, C110100, Cologne, CQ7790, CQ7790M, CQ8725S, CQ8750M, CQ8845S, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FSM100 Platform, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, G3x Gen 2, IPQ9048, IPQ9570, IPQ9574, IQ10 Series, IQ6 Series Platform, IQ8 Series Platform, IQ9 Series Platform, IQX5121, IQX7181, Kalpeni, LeMans_AU_LGIT, LeMansAU, Marina, MBM415, MBM715, Milos, Monaco_IOT, Netrani, NPro A8 Elite Platform, Orne, Palawan25, Pandeiro, Q-4390, Q-7790, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA0000, QCA2066, QCA4004, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8075, QCA8080, QCA8081, QCA8082, QCA8084, QCA8085, QCA8101, QCA8102, QCA8111, QCA8112, QCA8337, QCA8384, QCA8385, QCA8386, QCA8695AU, QCC2070, QCC6705, QCC710, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM5430, QCM6125, QCM6490, QCM8838, QCN5124, QCN5224, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCN9274, QCS2290, QCS4290, QCS4490, QCS8550, QDU1000, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMP1000, QMP2001, QNA715, QPA1083BD, QPA1086BD, QRU1032, Qualcomm Dragonwing™ QRU100 Platform, Qualcomm Dragonwing™ X100 Accelerator Card, Qualcomm QTS110 Tracker, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, Robotics RB2 Platform, Robotics RB5 Platform, SA2150P, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR2130P, SC8380XP, SD 8 Gen1 5G, SD662, SD865 5G, SDR753, SDX57M, SDX61, SDX71M, SM4850, SM4850P, SM6225P, SM6250, SM6450P, SM6475P, SM6475Q, SM6850, SM7325P, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM7750P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8735P, SM8750P, SM8845P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c Compute Platform, Snapdragon 7c Gen 2 Compute Platform "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8 Gen 5, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Ride™ Elite , Snapdragon Wear 1300 Platform, Snapdragon X2 Elite, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X62 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, Snapdragon® Cockpit Elite, Snapdragon® Reality Elite Platform, Snapdragon® Wear Elite platform, SRV1H, SRV1L, SRV1M, SW-only, SXR2230P, SXR2250P, Themisto, Trestles, WCD9306, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, XRV7209, XRV9209

CVE-2026-6727

CVE ID CVE-2026-6727
Description A timing side-channel vulnerability in RSA OAEP decryption was reported in the TCG TPM 2.0 reference code that could allow a local attacker with elevated privileges to decrypt ciphertexts (import blobs, credential blobs, and session salts) encrypted to the RSA Endorsement Key or falsify TPM 2.0 Attestation Keys. For more details, please refer to the Trusted Computing Group’s official advisory:https://trustedcomputinggroup.org/about/security/
Technology Area Windows Compute
Affected Chipsets* Snapdragon G1 Gen 2 Gaming Platform, 5G Fixed Wireless Access Platform, 9205 LTE Modem, 9205S Modem, AQT1000, AR8031, AR8035, C-V2X 9150, C110100, Cologne, CQ7790, CQ7790M, CQ8725S, CQ8750M, CQ8845S, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FSM100 Platform, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, G3x Gen 2, IPQ9048, IPQ9570, IPQ9574, IQ10 Series, IQ6 Series Platform, IQ8 Series Platform, IQ9 Series Platform, IQX5121, IQX7181, Kalpeni, LeMans_AU_LGIT, LeMansAU, Marina, MBM415, MBM715, Milos, Monaco_IOT, Netrani, NPro A8 Elite Platform, Orne, Palawan25, Pandeiro, Q-4390, Q-7790, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA0000, QCA2066, QCA4004, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8075, QCA8080, QCA8081, QCA8082, QCA8084, QCA8085, QCA8101, QCA8102, QCA8111, QCA8112, QCA8337, QCA8384, QCA8385, QCA8386, QCA8695AU, QCC2070, QCC6705, QCC710, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM5430, QCM6125, QCM6490, QCM8838, QCN5124, QCN5224, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCN9274, QCS2290, QCS4290, QCS4490, QCS8550, QDU1000, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMP1000, QMP2001, QNA715, QPA1083BD, QPA1086BD, QRU1032, Qualcomm Dragonwing™ QRU100 Platform, Qualcomm Dragonwing™ X100 Accelerator Card, Qualcomm QTS110 Tracker, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, Robotics RB2 Platform, Robotics RB5 Platform, SA2150P, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR2130P, SC8380XP, SD 8 Gen1 5G, SD662, SD865 5G, SDR753, SDX57M, SDX61, SDX71M, SM4850, SM4850P, SM6225P, SM6250, SM6450P, SM6475P, SM6475Q, SM6850, SM7325P, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM7750P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8735P, SM8750P, SM8845P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c Compute Platform, Snapdragon 7c Gen 2 Compute Platform "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8 Gen 5, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Ride™ Elite , Snapdragon Wear 1300 Platform, Snapdragon X2 Elite, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X62 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, Snapdragon® Cockpit Elite, Snapdragon® Reality Elite Platform, Snapdragon® Wear Elite platform, SRV1H, SRV1L, SRV1M, SW-only, SXR2230P, SXR2250P, Themisto, Trestles, WCD9306, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, XRV7209, XRV9209

* The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.

** Data is generated only at the time of bulletin creation

Industry Coordination

Security ratings of issues included in Android security bulletins and these bulletins match in the most common scenarios but may differ in some cases due to one of the following reasons:

  • Consideration of security protections such as SELinux not enforced on some platforms
  • Differences in assessment of some specific scenarios that involves local denial of service or privilege escalation vulnerabilities in the high level OS kernel

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.

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  • Table of Contents
  • Announcements
  • Acknowledgements
  • Proprietary Software Issues
  • CVE-2026-25289
  • CVE-2026-21366
  • CVE-2026-24079
  • CVE-2026-24080
  • CVE-2026-24084
  • CVE-2026-25288
  • CVE-2026-24076
  • CVE-2026-24078
  • Open Source Software Issues
  • CVE-2026-24083
  • CVE-2026-25292
  • CVE-2026-24077
  • CVE-2026-6726
  • CVE-2026-6727
  • Industry Coordination
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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