August 2026 Security Bulletin
Published: 08/03/2026
This security bulletin is intended to help Qualcomm Technologies, Inc. (QTI) customers incorporate security updates in launched or upcoming devices. This document includes (i) a description of security issues that have been addressed in QTI’s proprietary code and (ii) links to publicly available code where security issues have been addressed.
Please reach out to securitybulletin@qti.qualcomm.com for any questions related to this bulletin.
Table of Contents
| Announcements |
| Acknowledgements |
| Proprietary Software Issues |
| Open Source Software Issues |
| Industry Coordination |
Announcements
None
Acknowledgements
We would like to thank these researchers for their contributions in reporting these issues to us.
| CVE-2026-24079,CVE-2026-24084 | Bedran Karakoc |
| CVE-2026-25292 | Chen Runlin, Xu Liangjun and Wu Haitao from Xiaomi ShadowBlade Security Lab |
| CVE-2026-24076 | Andrea Monzani andrea.monzani@unimi.it |
| CVE-2026-24077 | Igor Morgenstern |
| CVE-2026-24078 | Dragos Vingarzan |
Proprietary Software Issues
The tables below summarize security vulnerabilities that were addressed through proprietary software
This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.
| Public ID | Security Rating | CVSS Rating | Technology Area | Date Reported |
|---|---|---|---|---|
| CVE-2026-25289 | Critical | Critical | WLAN Firmware | Internal |
| CVE-2026-21366 | High | High | Data Network Stack & Connectivity | Internal |
| CVE-2026-24079 | High | High | Data Modem | 07/18/2025 |
| CVE-2026-24080 | High | High | Biometrics | Internal |
| CVE-2026-24084 | High | High | Multi-Mode Call Processor | 08/25/2022 |
| CVE-2026-25288 | High | High | WLAN Firmware | Internal |
This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.
| Public ID | Security Rating | CVSS Rating | Technology Area | Date Reported |
|---|---|---|---|---|
| CVE-2026-24076 | Medium | Medium | Bluetooth HOST | 09/08/2025 |
| CVE-2026-24078 | Medium | Medium | Data Modem | 10/07/2024 |
CVE-2026-25289
| CVE ID | CVE-2026-25289 |
| Title | Stack-based Buffer Overflow in WLAN Firmware |
| Description | Memory Corruption when processing Device Capability Extended attributes in certain NAN Service Discovery Frames with invalid length values. |
| Technology Area | WLAN Firmware |
| Vulnerability Type | CWE-121 Stack-based Buffer Overflow |
| Access Vector | Remote |
| Security Rating | Critical |
| CVSS Rating | Critical |
| CVSS Score | 9.6 |
| CVSS String | CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H |
| Date Reported | Internal |
| Customer Notified Date | 2026/05/04 |
| Affected Chipsets* | AR8035, Cologne, CQ7790, CQ8725S, CQ8750M, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, FWA Gen 3 Ultra Platform, FWA Gen 5 Elite Platform, G2 Gen 1, G3x Gen 2, Immersive Home 3210 Platform, Immersive Home 326 Platform, IPQ5300, IPQ5302, IPQ5312, IPQ5332, IPQ9008, IPQ9554, IPQ9570, IPQ9574, IQX5121, IQX7181, Kobuk, LeMans_AU_LGIT, LeMansAU, Milos, Milos_IOT, Molokai, Netrani, Networking Pro 1210 Platform, Networking Pro 1610 Platform, Networking Pro 610 Platform, Networking Pro 810 Platform, Orne, Palawan25, Pandeiro, QAM8255P, QAM8397P, QAM8797P, QAMSRV1H, QAMSRV1M, QCA0000, QCA6391, QCA6554A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6777AQ, QCA6787AQ, QCA6797AQ, QCA8075, QCA8081, QCA8082, QCA8084, QCA8085, QCA8337, QCA8386, QCA8695AU, QCC2073, QCC2076, QCC710, QCF8000, QCF8001, QCN5124, QCN6224, QCN6274, QCN6402, QCN6412, QCN6422, QCN6432, QCN9000, QCN9011, QCN9012, QCN9024, QCN9274, QCS6690, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMB715, QMP1000, QMP2001, QPA1083BD, QPA1086BD, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, SA7255P, SA7775P, SA8255P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR2130P, SC8380XP, SDX65M, SDX81, SM6450P, SM6475P, SM6475Q, SM6650P, SM6850, SM7425, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8425, SM8550P, SM8635, SM8635P, SM8650Q, SM8735P, SM8750P, SM8845P, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X65 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon® Wear Elite platform, SRV1H, SRV1M, SXR2230P, SXR2250P, SXR2330P, SXR2350P, Themisto, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, X1E80100, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039, XRV7209, XRV9209 |
CVE-2026-21366
| CVE ID | CVE-2026-21366 |
| Title | Integer Overflow or Wraparound in Data Network Stack & Connectivity |
| Description | Memory corruption while processing a packet with a size close to the maximum allowed value. |
| Technology Area | Data Network Stack & Connectivity |
| Vulnerability Type | CWE-190 Integer Overflow or Wraparound |
| Access Vector | Local |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 7.8 |
| CVSS String | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| Date Reported | Internal |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | LeMans_AU_LGIT, LeMansAU, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA6574AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8695AU, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SRV1H, SRV1L, SRV1M |
CVE-2026-24079
| CVE ID | CVE-2026-24079 |
| Title | Missing Authentication for Critical Function in Data Modem |
| Description | Cryptographic Issue while processing registration requests with malformed or missing authentication parameters. |
| Technology Area | Data Modem |
| Vulnerability Type | CWE-306: Missing Authentication for Critical Function |
| Access Vector | Remote |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 8.1 |
| CVSS String | CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N |
| Date Reported | 2025/07/18 |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, Milos, Netrani, Orne, Palawan25, QCA6174A, QCA6391, QCA6574AU, QCA6584AU, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM2290, QCM4325, QCM4490, QCM5430, QCM6490, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCS2290, QCS4290, QCS4490, QCS8550, QEP8111, QFW7114, QFW7124, QMP1000, Qualcomm® Video Collaboration VC3 Platform, Robotics RB2 Platform, SD 8 Gen1 5G, SD662, SDX61, SM6225P, SM6650P, SM7325P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, SW5100, SW5100P, SW6100, SW6100P, Themisto, WCD9335, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H |
CVE-2026-24080
| CVE ID | CVE-2026-24080 |
| Title | Buffer Copy Without Checking Size of Input in Biometrics |
| Description | Memory Corruption when handling malformed request parameters in the fingerprint TA. |
| Technology Area | Biometrics |
| Vulnerability Type | CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow') |
| Access Vector | Local |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 7.8 |
| CVSS String | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| Date Reported | Internal |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | Cologne, FastConnect 6700, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QCA6574AU, QCA6595AU, QCA6678AQ, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA9000P, SW6100, SW6100P, Themisto, WCD9378C, WSA8840, WSA8845, WSA8845H, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039 |
CVE-2026-24084
| CVE ID | CVE-2026-24084 |
| Title | Insecure Security Identifier Mechanism in Multi-Mode Call Processor |
| Description | Weak configuration when UE does not verify the consistency of its additional security capabilities with the replayed capabilities. |
| Technology Area | Multi-Mode Call Processor |
| Vulnerability Type | CWE-1294: Insecure Security Identifier Mechanism |
| Access Vector | Remote |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 7.5 |
| CVSS String | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N |
| Date Reported | 2022/08/25 |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | 5G Fixed Wireless Access Platform, AQT1000, AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FWA Gen 3 Ultra Platform, Milos, Netrani, Orne, Palawan25, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6574AU, QCA6584AU, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM5430, QCM6490, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCS4490, QCS8550, QFW7114, QFW7124, QMP1000, Qualcomm® Video Collaboration VC3 Platform, SD 8 Gen1 5G, SDX57M, SDX61, SDX71M, SM6650P, SM7325P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon X80 5G Modem-RF System, Snapdragon Auto 4G Modem, WCD9340, WCD9341, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H |
CVE-2026-25288
| CVE ID | CVE-2026-25288 |
| Title | Buffer Over-read in WLAN Firmware |
| Description | Transient DOS when processing a short target wake time channel usage response frame with insufficient packet size. |
| Technology Area | WLAN Firmware |
| Vulnerability Type | CWE-126 Buffer Over-read |
| Access Vector | Remote |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 7.4 |
| CVSS String | CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:C/C:N/I:N/A:H |
| Date Reported | Internal |
| Customer Notified Date | 2026/05/04 |
| Affected Chipsets* | Cologne, CQ7790, FastConnect 6900, FastConnect 7800, Molokai, Orne, Palawan25, Pandeiro, QLN1083BD, QLN1086BD, QMB715, QMP1000, QMP2001, QPA1083BD, QPA1086BD, QXM1093, QXM1094, QXM1095, QXM1096, SC8380XP, SM6850, SM8735P, SM8845P, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 8 Elite Gen 5, WCD9370, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9395, WCN6450, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039, XRV7209, XRV9209 |
CVE-2026-24076
| CVE ID | CVE-2026-24076 |
| Title | Buffer Copy Without Checking Size of Input in Bluetooth HOST |
| Description | Memory Corruption when processing registry values with incorrect types using a direct query method. |
| Technology Area | Bluetooth HOST |
| Vulnerability Type | CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow') |
| Access Vector | Local |
| Security Rating | Medium |
| CVSS Rating | Medium |
| CVSS Score | 6.7 |
| CVSS String | CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H |
| Date Reported | 2025/09/08 |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | AQT1000, Cologne, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA0000, QCA2062, QCA2064, QCA2065, QCA2066, QCA6391, QCA6420, QCA6430, QCM5430, QCM6490, Qualcomm® Video Collaboration VC3 Platform, SC8380XP, SM6250, Snapdragon 7c Compute Platform, Snapdragon 7c Gen 2 Compute Platform "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, WCD9340, WCD9341, WCD9370, WCD9375, WCD9378C, WCD9380, WCD9385, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039 |
CVE-2026-24078
| CVE ID | CVE-2026-24078 |
| Title | Exposure of Private Personal Information to an Unauthorized Actor in Data Modem |
| Description | Information Disclosure when IPSec negotiation fails or is not established properly during NG-eCall SIP signaling. |
| Technology Area | Data Modem |
| Vulnerability Type | CWE-359: Exposure of Private Personal Information to an Unauthorized Actor |
| Access Vector | Remote |
| Security Rating | Medium |
| CVSS Rating | Medium |
| CVSS Score | 6.5 |
| CVSS String | CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N |
| Date Reported | 2024/10/07 |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | 5G Fixed Wireless Access Platform, AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, Milos, Netrani, Orne, Palawan25, QCA6174A, QCA6391, QCA6574A, QCA6574AU, QCA6584AU, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM2290, QCM4325, QCM4490, QCM5430, QCM6490, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCS2290, QCS4290, QCS4490, QCS8550, QEP8111, QFW7114, QFW7124, QMP1000, Qualcomm® Video Collaboration VC3 Platform, Robotics RB2 Platform, SD 8 Gen1 5G, SD662, SDX57M, SDX61, SM6225P, SM6650P, SM7325P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, SW5100, SW5100P, SW6100, SW6100P, Themisto, WCD9335, WCD9340, WCD9360, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H |
*The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.
Open Source Software Issues
The tables below summarize security vulnerabilities that were addressed through open source software
This table lists high impact security vulnerabilities. Patches are being actively shared with OEMs, who have been notified and strongly recommended to deploy those patches on released devices as soon as possible. Please contact the device manufacturer for information on the patching status of released devices.
| Public ID | Security Rating | CVSS Rating | Technology Area | Date Reported |
|---|---|---|---|---|
| CVE-2026-24083 | High | High | Automotive Security | Internal |
| CVE-2026-25292 | High | High | Automotive Linux OS | 01/18/2026 |
| CVE-2026-6726 | High | High | Windows Compute | Internal |
| CVE-2026-6727 | High | High | Windows Compute | Internal |
This table lists moderate security vulnerabilities. OEMs have been notified and encouraged to patch these issues.
| Public ID | Security Rating | CVSS Rating | Technology Area | Date Reported |
|---|---|---|---|---|
| CVE-2026-24077 | Medium | Medium | WLAN Host | 09/08/2025 |
CVE-2026-24083
| CVE ID | CVE-2026-24083 |
| Title | Untrusted Pointer Dereference in Automotive Security |
| Description | Memory Corruption while processing IOCTL device driver requests with invalid arguments. |
| Technology Area | Automotive Security |
| Vulnerability Type | CWE-822 Untrusted Pointer Dereference |
| Access Vector | Local |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 7.8 |
| CVSS String | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| Date Reported | Internal |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | QAM8295P, QCA6696, SA8295P |
| Patch** |
CVE-2026-25292
| CVE ID | CVE-2026-25292 |
| Title | Improper Validation of Syntactic Correctness of Input in Automotive Linux OS |
| Description | Memory Corruption when processing untrusted user input in the fastboot command handler for audio framework configuration. |
| Technology Area | Automotive Linux OS |
| Vulnerability Type | CWE-1286: Improper Validation of Syntactic Correctness of Input |
| Access Vector | Local |
| Security Rating | High |
| CVSS Rating | High |
| CVSS Score | 7.6 |
| CVSS String | CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H |
| Date Reported | 2026/01/18 |
| Customer Notified Date | 2026/05/04 |
| Affected Chipsets* | AR8031, AR8035, CQ7790, CQ8725S, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FWA Gen 3 Ultra Platform, FWA Gen 5 Elite Platform, G1 Gen 1, G2 Gen 1, G3x Gen 2, Kalpeni, Kobuk, LeMans_AU_LGIT, LeMansAU, Milos_IOT, Molokai, Netrani, Orne, Palawan25, Pandeiro, QAM8255P, QAM8295P, QAM8397P, QAM8797P, QAMSRV1H, QAMSRV1M, QCA2066, QCA6174A, QCA6391, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCA8386, QCA8695AU, QCA9367, QCA9377, QCC710, QCF8001, QCM2290, QCM4325, QCM4490, QCM6125, QCM6490, QCM8838, QCN6224, QCN6274, QCN9011, QCN9012, QCS2290, QCS4290, QCS4490, QCS6690, QCS8550, QDU1000, QDU1110, QDU1210, QDX1010, QDX1011, QEP8111, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMB715, QMP1000, QMP2001, QPA1083BD, QPA1086BD, QRB5165N, QRU1032, Qualcomm Dragonwing™ QRU100 Platform, Qualcomm Dragonwing™ X100 Accelerator Card, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, Robotics RB5 Platform, SA4150P, SA4155P, SA510M, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8620P, SA8770P, SA9000P, SAR1165P, SC8380XP, SD662, SD865 5G, SDR753, SDX81, SM4850, SM4850P, SM6225P, SM6450P, SM6475P, SM6475Q, SM6850, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM8550P, SM8735P, SM8750P, SM8845P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon® Wear Elite platform, SRV1H, SRV1M, SW5100, SW5100P, SXR2330P, SXR2350P, Themisto, WCD9335, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, X1E80100, XRV7209, XRV9209 |
| Patch** |
CVE-2026-24077
| CVE ID | CVE-2026-24077 |
| Title | Integer Underflow (Wrap or Wraparound) in WLAN Host |
| Description | Information Disclosure when processing wireless network channel switch information with improperly formatted length fields. |
| Technology Area | WLAN Host |
| Vulnerability Type | CWE-191 Integer Underflow (Wrap or Wraparound) |
| Access Vector | Remote |
| Security Rating | Medium |
| CVSS Rating | Medium |
| CVSS Score | 6.5 |
| CVSS String | CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N |
| Date Reported | 2025/09/08 |
| Customer Notified Date | 2026/02/02 |
| Affected Chipsets* | AQT1000, AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, Milos, Netrani, Orne, Palawan25, QCA6391, QCA6420, QCA6430, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6777AQ, QCA6787AQ, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM2290, QCM4325, QCM4490, QCM5430, QCM6490, QCN6224, QCN6274, QCN9011, QCN9012, QCS2290, QCS4290, QCS4490, QFW7114, QFW7124, QMP1000, QRB5165M, QRB5165N, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, Robotics RB2 Platform, Robotics RB5 Platform, SA6155P, SA8155, SA8155P, SA8195P, SD 8 Gen1 5G, SD662, SD865 5G, SM6225P, SM6650P, SM7325P, SM7435, SM7635P, SM7675, SM7675P, SM8475P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, SW5100, SW5100P, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9378, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H |
| Patch** |
CVE-2026-6726
| CVE ID | CVE-2026-6726 |
| Description | An information leakage vulnerability was reported in the TCG TPM 2.0 reference code that could allow a local attacker with elevated privileges to obtain a credential from a TPM-aware CA for a falsified TPM key (such as an Attestation Key, DevID Key or TLS authentication key) and falsify other TPM 2.0 attestations with this key. For more details, please refer to the Trusted Computing Group’s official advisory:https://trustedcomputinggroup.org/about/security/ |
| Technology Area | Windows Compute |
| Affected Chipsets* | Snapdragon G1 Gen 2 Gaming Platform, 5G Fixed Wireless Access Platform, 9205 LTE Modem, 9205S Modem, AQT1000, AR8031, AR8035, C-V2X 9150, C110100, Cologne, CQ7790, CQ7790M, CQ8725S, CQ8750M, CQ8845S, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FSM100 Platform, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, G3x Gen 2, IPQ9048, IPQ9570, IPQ9574, IQ10 Series, IQ6 Series Platform, IQ8 Series Platform, IQ9 Series Platform, IQX5121, IQX7181, Kalpeni, LeMans_AU_LGIT, LeMansAU, Marina, MBM415, MBM715, Milos, Monaco_IOT, Netrani, NPro A8 Elite Platform, Orne, Palawan25, Pandeiro, Q-4390, Q-7790, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA0000, QCA2066, QCA4004, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8075, QCA8080, QCA8081, QCA8082, QCA8084, QCA8085, QCA8101, QCA8102, QCA8111, QCA8112, QCA8337, QCA8384, QCA8385, QCA8386, QCA8695AU, QCC2070, QCC6705, QCC710, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM5430, QCM6125, QCM6490, QCM8838, QCN5124, QCN5224, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCN9274, QCS2290, QCS4290, QCS4490, QCS8550, QDU1000, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMP1000, QMP2001, QNA715, QPA1083BD, QPA1086BD, QRU1032, Qualcomm Dragonwing™ QRU100 Platform, Qualcomm Dragonwing™ X100 Accelerator Card, Qualcomm QTS110 Tracker, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, Robotics RB2 Platform, Robotics RB5 Platform, SA2150P, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR2130P, SC8380XP, SD 8 Gen1 5G, SD662, SD865 5G, SDR753, SDX57M, SDX61, SDX71M, SM4850, SM4850P, SM6225P, SM6250, SM6450P, SM6475P, SM6475Q, SM6850, SM7325P, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM7750P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8735P, SM8750P, SM8845P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c Compute Platform, Snapdragon 7c Gen 2 Compute Platform "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8 Gen 5, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Ride™ Elite , Snapdragon Wear 1300 Platform, Snapdragon X2 Elite, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X62 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, Snapdragon® Cockpit Elite, Snapdragon® Reality Elite Platform, Snapdragon® Wear Elite platform, SRV1H, SRV1L, SRV1M, SW-only, SXR2230P, SXR2250P, Themisto, Trestles, WCD9306, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, XRV7209, XRV9209 |
CVE-2026-6727
| CVE ID | CVE-2026-6727 |
| Description | A timing side-channel vulnerability in RSA OAEP decryption was reported in the TCG TPM 2.0 reference code that could allow a local attacker with elevated privileges to decrypt ciphertexts (import blobs, credential blobs, and session salts) encrypted to the RSA Endorsement Key or falsify TPM 2.0 Attestation Keys. For more details, please refer to the Trusted Computing Group’s official advisory:https://trustedcomputinggroup.org/about/security/ |
| Technology Area | Windows Compute |
| Affected Chipsets* | Snapdragon G1 Gen 2 Gaming Platform, 5G Fixed Wireless Access Platform, 9205 LTE Modem, 9205S Modem, AQT1000, AR8031, AR8035, C-V2X 9150, C110100, Cologne, CQ7790, CQ7790M, CQ8725S, CQ8750M, CQ8845S, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, FSM100 Platform, FSM200 Platform, FSM20055, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, G3x Gen 2, IPQ9048, IPQ9570, IPQ9574, IQ10 Series, IQ6 Series Platform, IQ8 Series Platform, IQ9 Series Platform, IQX5121, IQX7181, Kalpeni, LeMans_AU_LGIT, LeMansAU, Marina, MBM415, MBM715, Milos, Monaco_IOT, Netrani, NPro A8 Elite Platform, Orne, Palawan25, Pandeiro, Q-4390, Q-7790, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA0000, QCA2066, QCA4004, QCA6174A, QCA6391, QCA6420, QCA6430, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8075, QCA8080, QCA8081, QCA8082, QCA8084, QCA8085, QCA8101, QCA8102, QCA8111, QCA8112, QCA8337, QCA8384, QCA8385, QCA8386, QCA8695AU, QCC2070, QCC6705, QCC710, QCF8001, QCM2290, QCM4290, QCM4325, QCM4490, QCM5430, QCM6125, QCM6490, QCM8838, QCN5124, QCN5224, QCN6024, QCN6224, QCN6274, QCN9011, QCN9012, QCN9024, QCN9274, QCS2290, QCS4290, QCS4490, QCS8550, QDU1000, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMP1000, QMP2001, QNA715, QPA1083BD, QPA1086BD, QRU1032, Qualcomm Dragonwing™ QRU100 Platform, Qualcomm Dragonwing™ X100 Accelerator Card, Qualcomm QTS110 Tracker, Qualcomm® Video Collaboration VC1 Platform, Qualcomm® Video Collaboration VC3 Platform, Qualcomm® Video Collaboration VC5 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, Robotics RB2 Platform, Robotics RB5 Platform, SA2150P, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR2130P, SC8380XP, SD 8 Gen1 5G, SD662, SD865 5G, SDR753, SDX57M, SDX61, SDX71M, SM4850, SM4850P, SM6225P, SM6250, SM6450P, SM6475P, SM6475Q, SM6850, SM7325P, SM7435, SM7435P, SM7525, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM7750P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8735P, SM8750P, SM8845P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7 Gen 4 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform, Snapdragon 782G Mobile Platform, Snapdragon 7c Compute Platform, Snapdragon 7c Gen 2 Compute Platform "Rennell Pro", Snapdragon 7c+ Gen 3 Compute, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8 Gen 5, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform, Snapdragon 870 5G Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform, Snapdragon 8c Compute Platform "Poipu Lite", Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite", Snapdragon 8cx Compute Platform, Snapdragon 8cx Compute Platform "Poipu Pro", Snapdragon 8cx Gen 2 5G Compute Platform, Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro", Snapdragon 8cx Gen 3 Compute Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Ride™ Elite , Snapdragon Wear 1300 Platform, Snapdragon X2 Elite, Snapdragon X53 5G Modem-RF System, Snapdragon X55 5G Modem-RF System, Snapdragon X62 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, Snapdragon XR2+ Gen 1 Platform, Snapdragon Auto 4G Modem, Snapdragon® Cockpit Elite, Snapdragon® Reality Elite Platform, Snapdragon® Wear Elite platform, SRV1H, SRV1L, SRV1M, SW-only, SXR2230P, SXR2250P, Themisto, Trestles, WCD9306, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3980, WCN3988, WCN6450, WCN6650, WCN6755, WCN7760, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, WSA8850, WSA8850W, WSA8855C, XRV7209, XRV9209 |
* The list of affected chipsets may not be complete. For latest information, device OEMs can contact QTI directly at www.qualcomm.com/support.
** Data is generated only at the time of bulletin creation
Industry Coordination
Security ratings of issues included in Android security bulletins and these bulletins match in the most common scenarios but may differ in some cases due to one of the following reasons:
- Consideration of security protections such as SELinux not enforced on some platforms
- Differences in assessment of some specific scenarios that involves local denial of service or privilege escalation vulnerabilities in the high level OS kernel
All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.
This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.
Qualcomm Technologies, Inc.
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- Table of Contents
- Announcements
- Acknowledgements
- Proprietary Software Issues
- CVE-2026-25289
- CVE-2026-21366
- CVE-2026-24079
- CVE-2026-24080
- CVE-2026-24084
- CVE-2026-25288
- CVE-2026-24076
- CVE-2026-24078
- Open Source Software Issues
- CVE-2026-24083
- CVE-2026-25292
- CVE-2026-24077
- CVE-2026-6726
- CVE-2026-6727
- Industry Coordination
